Welcome to the Power Semiconductor Assembly Blog
Welcome to the Power Semiconductor Assembly Blog, Indium Corporation’s information watercooler for the Power Semiconductor assembly industry. So...
Solder Alloys
Ed Briggs Weighs in on "Graping"
Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation’s technical staff. I asked Ed if he would share with us his tho...
Solder Alloy Powder Misconceptions
For a change of pace, again, I have asked another Technical Support Engineer, Chris Nash, to comment about powder sizes. Chris is the Regional T...
Other Benefits of a Good Solder Joint
Proper solder joints provide mechanical, electrical, and thermal interconnections that are reliable over the course of a product’s lifespan. spa...
Bismuth Solders
When you think of solders, you generally think of tin, lead, copper, silver. But have you ever considered bismuth? Bismuth as a pure metal...
Step 2 to Consider When Designing a Trouble-Free Solder Joint
Once you have an understanding of the type of solder needed for an application, (a hard solder such as AuSn for reflow temperatures above 125&d...
Steps to consider when designing a trouble-free solder joint:
http://upload.wikimedia.org/wikipedia/commons/b/ba/Thermometer.jpg Operational temperature Metallizations Flux usage Reflow method Temperature limitat...
Interest in Metal Alloy Density Calculator Still Strong
Folks, I continue to get much interest in the solder alloy density calculator I developed some years ago. It is now online at http://www.indium....
The Future of BGA Assembly
What is in store for us 5 or 10 years from now? My best guess is that new substrate......
Surface Finishes 2: Soldering to Copper and Soldering to OSP
Soldering to copper has been around since the beginning of soldering itself. Copper wiring and copper pipes are where soldering began, and copper is s...