What To Expect When Stencil Printing Flux
In a perfect world, materials printed through a circular stencil aperture would be column-like with a flat top. When you look closely at a printed fl...
In a perfect world, materials printed through a circular stencil aperture would be column-like with a flat top. When you look closely at a printed fl...
Why doesn’t my solder flow? The most common issue preventing good solder wetting on a substrate is oxidation. All metals are prone to some level...
Just in case you haven’t heard of epoxy flux yet, let me fill you in. Epoxy flux is what I call a “super no-clean” flux. A no-c...
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials......
Do you have a 2’ x 3’ area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? a......
Just incase you were wondering, here are the wetting results you can expect when soldering Pb-free spheres to different surface finishes. The chart sh...
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...