SMTA International 2014 in Retrospect
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...
The other day I was watching the classic film “King Kong vs Godzilla” with my son. At one point, I believe related to some prequel t...
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of thr...
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am e...
Folks, A while ago, I developed an Excel-based spreadsheet, StencilCoach™, that calculates optimal stencil aperture parameters for several commo...
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standar...
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliab...
Let’s talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most p...
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...
Folks, In the nearly ten years that I have been blogging, I am continually surprised by the interest in a spreadsheet I created that calculates alloy ...