SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post...
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If ...
Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure 1. In the last discussion we statistically evaluated an...
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...
The other day I was watching the classic film “King Kong vs Godzilla” with my son. At one point, I believe related to some prequel t...
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of thr...
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am e...
Folks, A while ago, I developed an Excel-based spreadsheet, StencilCoach™, that calculates optimal stencil aperture parameters for several commo...
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standar...
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliab...