Posted On: June 23rd, 2014 | By: Indium Corporation®

Viscosity And The Printable Nature of Solder Paste

Let’s talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most p...

Posted On: June 19th, 2014 | By: Ed Briggs

Stencil Printing for Success: Solder Paste Handling and Storage

SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...

Posted On: June 17th, 2014 | By: Dr. Ron Lasky

Alloy Density Calculator Generates Most Interest of All Blog Posts

Folks, In the nearly ten years that I have been blogging, I am continually surprised by the interest in a spreadsheet I created that calculates alloy ...

Posted On: April 28th, 2014 | By: Dr. Ron Lasky

Handbook of Electronic Assembly Now Available

Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...

Posted On: March 31st, 2014 | By: Eric Bastow

What a J-STD-004 classification of "OR" means and what it doesn't mean

Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recogn...

Posted On: March 3rd, 2014 | By: Indium Corporation®

A New Focus for 2014

The beginning of 2014 brought an interesting opportunity for me, the availability of a position as a Manufacturing Engineer at Indium Corporation (at ...

Posted On: February 3rd, 2014 | By: Christopher Nash

Printer Process Set-up

Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industr...