Posted On: September 25th, 2013 | By: Seth Homer

Practical suggestions for solder preform design

Have you ever found yourself knowing where you want to go, but not sure how to get there? This can be frustrating and time......

Posted On: September 23rd, 2013 | By: Christopher Nash

Calculating Solder Paste Usage

Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production run. Calculating...

Posted On: September 19th, 2013 | By: Indium Corporation®

IMAPS 2013: International Symposium on Microelectronics

The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...

Posted On: September 12th, 2013 | By: Indium Corporation®

Tech Spotlight: Derrick Herron

Today we focus on Derrick Herron – one of the newest members of Indium Corporation’s Technical Services team. While new to tech servi...

Posted On: July 30th, 2013 | By: Indium Corporation®

A Bond Tester That Can Grow With Your Company

It’s been a while since I have mentioned equipment on this blog, so I began by searching for updates to equipment I already know and enjoy. It...

Posted On: June 10th, 2013 | By: Dr. Andy Mackie

Reflow of Copper Pillar Microbumps

Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...

Posted On: May 30th, 2013 | By: Dr. Ron Lasky

The Limits of Mixing: A Chocolate Chip Example

Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are ...

Posted On: April 18th, 2013 | By: Indium Corporation®

NanoFoil® for CPV Attachment

The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less...

Posted On: April 5th, 2013 | By: Seth Homer

The Magic of Engineered Solders

Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or co...