Moving from Silver Epoxy to Solder in Power Semiconductor Packaging
At the time of writing, the price of silver (Ag) was approaching the USD$50/tr.oz. (Troy ounce) level, and threatening to go higher. With 1 Troy ounce...
At the time of writing, the price of silver (Ag) was approaching the USD$50/tr.oz. (Troy ounce) level, and threatening to go higher. With 1 Troy ounce...
Folks, It was Wednesday evening and I had just finished a brief pitch on applications of SPC to a group of twenty. I was followed by Jim Ha...
Folks, HIS iSuppli performed a teardown analysis of an iPad . They estimate that the cost of the bill of materials (BOM) is $336....
Folks, I thought I would take a stab at listing the minuses, pluses, and “it’s a wash” aspects of assembling with lead-free (LF) sol...
A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materia...
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dippi...
I just received a customer inquiry regarding a phenomenon that is little studied and even less quantified; “How many times can I reflow a s...
Folks, Patty had been working with engineering on a new product that needed a very precise and controlled volume of the stencil printed “brick&...
Jon major recently joined the Indium Corporation as a Product Manager for Solar back-end assembly products. I greeted him with this impromptu int...
Tombstoning, simply, is the wetting of one side of a component before the other side, which causes the setting forces of the solder to lift the compon...