Applying TacFlux® to a Solder Thermal Interface Material
The process of applying a solder thermal interface material typically includes applying flux to a solder preform and reflowing it in......
The process of applying a solder thermal interface material typically includes applying flux to a solder preform and reflowing it in......
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as ...
Folks, Over the past few years I have been surprised at the interest in the Excel based alloy density calculator that I developed. Thanks for yo...
This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way......
Dr. Harald Wack of Zestron img src="http://www.indium.com/_images/0725/zestron_cleaning_ball_attach_flux_wafer_2.jpg" alt="Weve lea...
Solder paste for printing follows the same guidelines as solder paste for dispensing. The good news about solder paste for printing is the apertu...
On July 16th and 17th, the IPC has organized a 2-day event in Boston to discuss the challenges with environmentally friendly electronics assembly. A s...
One of the primary concerns with halogen-free solder pastes and fluxes revolves around the wetting and coalescence. The reason that halogens (usually ...
Folks, I recently met a colleague and the following discussion ensued: Dr. Ron (DR): How are things? Colleague©: Kinda discouraging at my......