Two big names in electronics assembly (Vern Solberg andPhil Damberg)recently wrote an article for Circuits Assembly Magazine regarding "PoP Assembly Process Fundamentals". The article goes through the background of package-on-package, the components, the PoP solder paste dipping process, reflow, and post-assembly solder evaluation. Most authors would stop there, but as a bonus,Vern and Phildiscuss reinforcement, warpage, future trends, and future package technologies.
Now, I like to think I generally have my finger on the pulse of who is using our PoP solder pastes, but this one completely slipped past me. I was happily surprised to read that they referenced Indium Corporation PoP solder paste – cool! When I was learning about semiconductor packaging years ago, I learned a lot from Vern's tech papers. This was personally rewarding to be mentioned by an industry leader like him. If you're reading this – thanks Vern and Phil!
~Jim Hisert
