Advanced Solder Paste is Key to Improving QFN Reliability
Paste deposits printed for a QFN footprint In an article from Circuits Assembly......
Paste deposits printed for a QFN footprint In an article from Circuits Assembly......
For our second guest blogger i would like to introduce Dr. Harald Wack, President of Zestron. Zestron is manufacturer of flux residue cleaners a...
Seth Homer is a Product Support Specialist for Engineered Solder Materials. He’s like a Green Beret or Navy Seal of solder preforms...
Proper solder joints provide mechanical, electrical, and thermal interconnections that are reliable over the course of a product’s lifespan. spa...
Indium Foil used as a thermal interface can easily be handled with pick and place tools. ......
Image: periodictable.com In recent days, one of my fellow applications engineers, Jim Hisert posted a blog on his semiconductor website about indium b...
To ensure high quality, reliable solder connections, for most devices it is a requirement to have very clean substrates. Without a clean substra...
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as ...
Liquid Metal Thermal Interface Materials Dispensing Thermal Grease. Image Courtesy of computershopper.com ......
A typical thermal cycling chamber used for accellerated life testing of TIMs. span......
Dr. Harald Wack of Zestron img src="http://www.indium.com/_images/0725/zestron_cleaning_ball_attach_flux_wafer_2.jpg" alt="Weve lea...
Mike Fenners article of soldering in automotive devices can be found in the June edition of OnBoard Technology ......