The Rule of 3/N for Estimating Field Failure Rates
Folks, It looks like Patty is a bit troubled....... When she was younger, Patty was always annoyed by cranky old people, and now she was worryin...
Solder Reliability
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electroni...
Changing the Composition of Your Tin-Lead Solder Pot
In today’s electronics manufacturing industry, many companies are using lead-free solder alloys. However, there are a few sectors in the industr...
Lead Free 2015
Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...
Reflow Profiling, Electrical Reliability, No-Clean Solder Paste Flux Residues
It sounds bad for me to say this, but I have a lot of SMT magazines cross my desk and, honestly, the solder paste articles rarely draw my interest. I ...
Design Solutions for Engineered Solders
Today’s technology simplifies the translation of an idea into a design. A drawing can be dimensioned in an instant. Thermal models and str...
Die-Attach Soldering Using Indium Alloys
There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Mat...
ELV 2014: High-Lead (Pb) in Automotive Electronics is Good until at Least 2023
Those of you who have been watching this blog for a while - waiting for updates on the European ELV (End of Life Vehicle) legislation - wait no m...
Soldering to Magnet Wires with 50In50Pb Alloy
The Indium Corporation recently had a customer contact us looking for 50In50Pb solder wire. We manufacture large amounts of this indium-lead mat...
SMTA International 2014 in Retrospect
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...
Pin-in-Paste Aperture Solder Volume Calculations with StencilCoach(TM)
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of thr...
SMTAI 2014 - Technical Conference Participation
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am e...