Indium Experts at APEX EXPO 2013
The 2013 IPC APEX Expo , the premiere electronics assembly event, is right around the corner – and our technology experts are ready to share the...
Solder Reliability
Weibull Analysis II: The Curse of the Early First Failure
Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste....
Interpreting Weibull Plots: I
Folks, A while ago I discussed the Weibull Distribution and its importance in electronics reliability analysis. This distribution has been use...
Solder Paste for Low Temperature and Pb-Free Applications
There are a lot of parameters to consider when choosing the right solder for your application: 1) The operational temperature of the final device p st...
Cleaning No-Clean Solder Paste Residues in SMT Assembly
Folks, There is a lot of interest in cleaning PCBs that have been assembled with no-clean solder pastes. Recently I discussed the topic with my ...
Indium-Lead (In/Pb) Solder Alloys for Reliable Gold Interconnects in Semiconductor Assembly
Maria Durham, Indium’s new Technical Specialist in Semiconductor and Advanced Assembly Materials, has been doing some research on indium lead (I...
Soldering Nitinol: The Oxides Are Reduced, Now What?
Reducing the surface oxides of Nitinol is just the first step in getting a good solder joint with this versatile medical assembly material. Next you h...
Patty Presents Her Electronics Assembly Copy Exactly Strategy
Folks, Patty is getting ready for her meeting on “Copy Exactly” with Mike Madigan….... It was after 6:30 PM and Patty was just arri...
Jasbir Bath and the Solar Engineering and Manufacturing Association (SEMA)
I recently had a chance to catch up with a friend and colleague, Jasbir Bath. If you’ve spent time in the electronics assembly industry you have...
Effecting And Evaluating Tabbing Ribbon Bond Strength, Reliability, And Performance
Readers have asked how to visually assess a tabbing ribbon interconnection after a bond test. This image is a cell that has been bond tested after sol...
Electronics with 40 Year Shelf Life
Folks, A reader writes: My company makes an electronic product that requires a 40 year shelf life. We assemble with tin-lead solder on FR-4 PWBs....
3 Advantages of Bismuth-Based Tabbing Ribbon for Solar Photovoltaic Assembly
After the report by Isofoton regarding reliability testing of Bi-based alloys for tabbing ribbon, the world learned that Bi-based alloys could survive...