Epoxy Flux Dipping for CSP and PoP Applications
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dippi...
Solder Spheres
Lead-Free Solder Thermal Cycling & Drop Shock Reliability is Looking Good
Folks, I was at SMTAI (Surface Mount Technology Association International) from September 24 and 27, 2010. As I mentioned, I cha...
HIP in Shanghai
Patty, Rob, and The Professor finished their tasks in Shenzen and were flying to Shanghai for their last set of challenges in electronics assembly.&nb...
Unique Solderspheres
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acqui...
Solder Shelf Life as Explained by Eric Bastow
Shelf life of solder is a concern that is raised by customers on a somewhat regular basis. Solder pastes typically have a well defined shelf lif...
A Day in the Life of a Tech Guy
7:40am Just got in, fired up the laptop, and made some hot chocolate. This is the best time to get a......
Effect of Powder Size on Solder Paste (part II)
... and we’re back now with the real situation of solder powder size and its effect on solder paste rheology. Size distribution – Real sol...
Effect of Particle Size on Solder Paste (Part I)
A well-respected colleague asked this week if the metal loading of type ‘4’ solder powder in a paste was lower than that for type ‘3...
How Much Metal is in Solder Paste?
Something that seems counter-intuitive to many customers, yet seems obvious to a rheologist is why the percent metal loading of solder paste vari...
Mixed Alloy Wetting for SAC BGA Assembly Using Sn63 Solder Paste
Have you ever wondered about what happens to a Pb-free Ball-Grid Array (BGA), with Tin/Silver/Copper (SAC) spheres in a Tin/Lead (Sn/Pb) proces...