Package-on-Package Component Dipping (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...
Solder Spheres
Package-on-Package Paste Leveling (1/5)
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...
Application Engineering
Part of having a hobby is to learn as much as you can about that area of interest. Most hobbies have a ‘glass ceiling’ when you discover y...
Mackie, Hisert and Low Publish "Solder in Chip Packaging Article"
Folks, My Indium colleagues Dr. Andy Mackie, Jim Hisert and Adrian Low published a nice overview article on Solder Use in Chip Packaging. The article ...