Choosing the Best Metallization for your NanoBond® Application
Since the NanoBond® process is almost instantaneous, fluxes are not used. (They just don’t have enough time to heat up to their activation t...
Since the NanoBond® process is almost instantaneous, fluxes are not used. (They just don’t have enough time to heat up to their activation t...
Folks, In the last posting, we saw how Weibull analysis helped us to determine that SACm® lead-free solder (SAC105 with about 0.1% manganese) has ...
Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let’s now derive the relationships needed to calculate the slop...
In an earlier post I mentioned that cross-sectioning a NanoBond® was one of my favorite tests. My other favorite test is shear testing. It̵...
During a NanoBond® reaction, assembly pressure may determine if you create a quality solder joint. There are many details that can influence how ...
It is hard to believe, but 50 years ago, on October 9th, the first visible light LED was demonstrated by Nick Holonyak, Jr. of GE Advanced......
One of my favorite methods of examining a solder bond is cross sectioning. This may not give you a view over the entire area of the bondline, or give ...
Folks, The Weibull distribution is arguably the most important distribution in failure analysis of leaded and lead-free solder joints. ...
The first time I was taught how to solder (as a child), I was told: “All the surfaces need to be mechanically cleaned and chemically cleaned.&rd...
The first step of the NanoBond® process should usually happen long before the NanoFoil® arrives at your facility. DFM (design for manufacturin...
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sz...
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin)...