Ultrasonic Testing a NanoBond® Solder Bond
Ultrasonic Testing (UT), performed by acoustic microscopy, is a great way to determine the quality of a solder bond without destroying the assembly. ...
Ultrasonic Testing (UT), performed by acoustic microscopy, is a great way to determine the quality of a solder bond without destroying the assembly. ...
To successfully use NanoFoil®, you do not need to fully understand what it is or how it is made, although that does help. It also makes for a...
When helping customers with the optimization of their soldering process, the question often comes up; “What will my solder bond line thickn...
Folks, Let’s see how Patty and Pete are making out on their latest adventure…. “Here is the ProfitPro™ output,” Dave...
The Indium Corporation has developed a new solder research kit designed specifically to meet the needs of medical manufacturers who are soldering to N...
Here is a picture of an Indium Corporation solder flux pen, sectioned to show you the internals. Who DOESN’T want to see THAT, right?!? Fl...
It is summer time again in the Northern Hemisphere and many places, especially in North America, are experiencing record heat. It also seems that most...
Folks, It has been a while, let’s look in on Patty…... Patty had to admit that she was very fortunate. She had yet to t...
About a month ago I posted about the various 3D technologies (chip creation, packaging and printed circuit boards) that are being used to op...
Folks, This year will mark the 10th anniversary of SMTA’s SMT Process Certification Course. This course was developed by Jim Hall, Phil Za...
It won’t be long until we in the northern hemisphere are complaining about the snow and the cold, but right now, it is all about the heat! ...