Solder Mask Controls Interconnects
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
For the second half of Solder Paste Transfer Efficiency, I would like to talk about tolerances and the Rule of 10% Standard Deviation (σ). From ...
With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials......
Do you have a 2’ x 3’ area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? a......
Okay, I’ll be honest – I think it’s pretty cheesy to write an entry on Valentines Day regarding my passion for the industry. I will,...
Just incase you were wondering, here are the wetting results you can expect when soldering Pb-free spheres to different surface finishes. The chart sh...
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
I love to read white papers from the 1930’s on indium (the element). People had no idea what interesting properties they would discover from wor...
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Engineered Solders have a long history at Indium. They have been called many things that made sense to us because of the way we made them. But......
A great Indium Knowledge Base question came from a customer last week for “recommendations on solder paste height versus component pitch…&...
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...