Engineered Solders with a European Flavour
Alan Fairbairn Guest Blogger European Business Development Manager Engineered Solders Materials I hope I can bring a European flavour to Engine...
Alan Fairbairn Guest Blogger European Business Development Manager Engineered Solders Materials I hope I can bring a European flavour to Engine...
Due to the limitations of flux, there is bottom end temperature where traditional solder/flux bonding ends. The lowest temperature I have experienced ...
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...
Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. ......
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can l...
Head-in-pillow defects caused by everything before the components go on-line can be grouped into Supply Issues. Some specific issues within this group...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....
Have you ever had to hand-place solder washer preforms on the pins of a connector and found it to be very labor intensive? Indium Corporation has a pr...