Square Solder Wire - A New "Twist" on an Old Product?????
Round solder wire, especially flux-cored, has been a mainstay of the electronics industry ever since electronics came into existence. Round solde...
Solderability
High Reliability Solder Preform Flux Coating for the Telecom Industry
The telecom industry relies heavily on Telcordia (Bellcore) testing to determine the electrical reliability of no-clean solder flux residues. There ar...
Does Lead-Free Assembly Use a Lot More Electricity and High Melt Lead-Free Solders?
Folks, An obvious disadvantage of lead-free assembly is that the oven must be hotter and therefore will use more electricity. But is the extra ...
Handbook of Electronic Assembly Now Available
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...
What a J-STD-004 classification of "OR" means and what it doesn't mean
Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recogn...
Donuts and Solder Preforms – Seriously?
I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in...
A New Focus for 2014
The beginning of 2014 brought an interesting opportunity for me, the availability of a position as a Manufacturing Engineer at Indium Corporation (at ...
An Example of Cpk and Non Normal Data In Electronics Assembly Soldering
Folks, Let’s see how Patty is doing after teaching her first class at Ivy U… Patty arrived at home after teaching her first class at Ivy ...
One-Step OSP BGA Soldering Application
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...
Printer Process Set-up
Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industr...
Effect of Package and Die Size on Dipping and Pick-up
While in South East Asia last summer, Indium’s technical team and I had a chance to discuss flip-chip dipping processes with a major equipment v...
The Importance of Oxygen Barrier in Solder Pastes
Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste.&nb...