Starvation Voids: When too little (paste) becomes too much (voiding)
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
Avoid The Void
An Overview of Vacuum Reflow Soldering
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...
Avoid the Void®: Beyond QFN Voiding
Kim Flanagan, Technical Support Engineer, and Phil Zarrow discuss how to Avoid the Void® by looking at four non-QFN void types—Kirkendall (c...
Avoid The Void®: Indium8.9HF Halogen-free, Pb-free Solder Paste with Andreas Karch
Andreas Karch reviews how you can Avoid The Void® with Indium8.9HF Solder Paste ...
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Voiding is a major problem in electronics assembly, especially in high-temp applications ...
Avoid the Void®: Voiding in High-Temperature Soldering
Gold-tin eutectic solder can be used as the second-step solder, after the initial die-attach step. ...
Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints
Using gold-tin solder in high-temp applications for both high-temperature and LED applications, there's been an increase in voiding which may corr...
Interview with Sze Pei Lim at Productronica China 2017
Interview with Sze Pei Lim at Productronica China 2017. ...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding Results
This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is ...
Avoid the Void® Common Causes of Voiding in Electronics Assembly
This video is for anyone interested in the causes and effects of voiding in solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, voidin...
Voiding in Flux-Cored Wire
Voiding in flux-cored wire causes serious problems. Learn about the causes of voiding and a way to Avoid The Void®...
Flux-Cored Wire in Robotic Soldering
Looking for a way to Avoid the Void® using high-quality cored wire? Click here....
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...
Voiding in Electronics Assemblies: Causes & Mitigation
Learn how to reduce voiding in electronics assemblies through the use of proper process and materials. ...
Causes and Solutions to Voiding in Die-Attach
This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...
Voiding in Die-Attach Electronics Assembly
This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...
To Minimize BTC Voiding, Start with the Right Solder Paste
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six S...
Avoid the Void®
Voiding is a complex problem with complex solutions. It isn't always just a matter of switching out the solder paste and finding the solution.&nbs...
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®
For process engineers hoping to reduce voiding in electronics assembly, watch as I discuss the reliability of Indium10.1 and Indium8.9HF and how they ...
Avoid the Void® Using Heat-Spring Metal Thermal Interface Materials
Watch as I discuss voiding in thermal management and how you can Avoid the Void®....
Reducing Voiding in Bottom-Terminated Components Using Solder Fortification® Preforms
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....