Optimized QFN Printing Tips
Beware of offset die, i.e. a thermal slug not centered in the device body but offset to the side. and too little solder paste deposited on thermal slu...
Beware of offset die, i.e. a thermal slug not centered in the device body but offset to the side. and too little solder paste deposited on thermal slu...
Brook Sandy-Smith will be moderating the Bottom Termination Components Design Panel at ICSR 2017....