Viscosity Versus Tack
Viscosity and tack are two important material properties that define a flux. People often “tack” them together as one, thinking they go ha...
Solder Paste
Starvation Voids: When too little (paste) becomes too much (voiding)
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
Adopting Semiconductor Assembly Process Techniques and Technologies
Indium Corporation’s Miloš Lazić, Technical Support Engineer, and Sze Pei Lim, Regional Manager, Semiconductor, discuss new technolo...
Stages of a Reflow Profile: Part IV
The cool down rate of a profile can affect the grain structure of a solder joint, thus determining the mechanical strength of the solder joint....
Tech Seconds: How to Troubleshoot Head-in-Pillow (HIP) Defects
In this installment of Tech Seconds, Phil examines the best methods used to troubleshoot head-in-pillow (HIP) defects ...
Tech Seconds with Phil Zarrow: Solder Paste Storage & Handling: Ambient Temperatures
Indium Corporation’s Tech Seconds video series answers electronics assembly industry’s most commonly asked question in 60 seconds or less....
Avoid the Void®: An Introduction to Indium10.1HF Solder Paste
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow introduce Indium Corporation’s new halogen-free, no-cl...
Importance of Profiling a Reflow Oven
Trying to select and develop the proper reflow profile? This video explores the differences between the three main profile types. ...
Interview with Sze Pei Lim at Productronica China 2017
Interview with Sze Pei Lim at Productronica China 2017. ...
Indium8.9HF Solder Paste: Material Comparisons for Soldering Process Issues
Material Comparisons for Soldering Process Issues. ...
Why Solder Paste is Not a Commodity: Properties that Make a Superior Solder Paste
Solder paste is not a commodity, and its critical to know exactly why....
SiP Materials (System-in-Package) VIDEO
There exists a wide range of assembly products for the SiP process, especially solder pastes....
What is a preform?
Phil Zarrow: Derrick, solder preforms. What are they? Derrick Herron: Well, a solder preform is a defined shape and size of a solder alloy. It can be ...
The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...
A 10 Sigma Solder Paste Printing Process?
Folks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s sm...
Partially Cleaning No-Clean Solder Paste - the Godzilla effect
The other day I was watching the classic film “King Kong vs Godzilla” with my son. At one point, I believe related to some prequel t...
SMTAI 2014 - Technical Conference Participation
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am e...
Introducing Indium10.1 – the best Pb-free solder paste to prevent voiding
Indium Corporation works hard to ensure that we have solder pastes that suit all of our customers’ needs. Our R&D team works closely with ou...
Viscosity And The Printable Nature of Solder Paste
Let’s talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most p...
Indium Solder Paste
Indium metal powder is mixed with flux for application by dispensing or printing equipment. This mixture is referred to as solder paste. Lucky fo...
Calculating Solder Paste Usage
Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production run. Calculating...
Time Required for Refrigerated Flux and Solder Paste to Reach Room Temperature
One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux...
Solder Paste for Low Temperature and Pb-Free Applications
There are a lot of parameters to consider when choosing the right solder for your application: 1) The operational temperature of the final device p st...
Solder Paste/Preform Bond Line Thickness
When helping customers with the optimization of their soldering process, the question often comes up; “What will my solder bond line thickn...
Calculating Solder Paste Usage
Calculating the exact amount of solder paste needed for a given circuit board or for a full production run can be difficult for several reasons, inclu...
Improved Solder Density and Solder Paste Volume Fraction Tool
Folks, It is hard to believe that I have been blogging for over 7 years now. In all this time it has surprised me how much interest there has be...
锡膏印刷速度的一个小故事 A Story of Solder Paste Printing Speed
SMT: A Story of Solder Paste Printing Speed 近期我们有一个客户在解决一&#...
锡膏和底部填充剂的兼容性 (Solder Paste Compatiblity with Underfill in SMT)
在SMT中，底部填充剂(underfill) 常常被用在BGA/QPN 的组装...
Solder Paste Expiration / Shelf Life
Solder paste is comprised of powdered solder alloy suspended in a flux vehicle. There is a group of flux ingredients that is generically identified as...
Tin/Silver Solder Paste in Die Attach (Sn/Ag)
A customer at Semicon West this year asked about Pb-free solder usage in die-attach applications. Although many smaller discrete components ...
Pb-Free: What Do You Need?
Everyone in the business has been collecting Pb-Free product literature (solder pastes, fluxes, etc.) for the past two years....