Posted On: February 27th, 2023 | By: Dr. Ron Lasky

P Value Calculator for F Statistics

Folks, In my last post, I discussed an Excel® spreadsheet to calculate p values for hypothesis tests in which the t distribution is employed. The ...

Posted On: October 7th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Follow-Up

Recently, I hosted a webinar for Stencil Printing for System in Package Applications. I wanted to take some time to offer a better explanation on impo...

Posted On: August 21st, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Stencil Technology

Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...

Posted On: March 12th, 2021 | By: Indium Corporation®

Stencil Printing 101 Webinar Follow-up

Recently, I hosted a webinar for Stencil Printing 101. The InSIDER Series contained two parts. The first is on the basics: Solder paste 101 – th...

Posted On: July 28th, 2018 | By: Dr. Ron Lasky

Hypothesis Test Spreadsheet for Cpk of Stencil Printing Transfer Efficiency

If you are interested in monitoring transfer efficiency Cpks to reduce end-of-line soldering defects, you will be interested in this post to hep calcu...

Posted On: June 13th, 2017 | By: Phil Zarrow & Dr. Ron Lasky

Calculating Confidence Intervals of Cpk in Stencil Printing

In stencil printing, the basic foundation is transfer efficiency. About two-thirds of all end-of-line defects can be traced back to the stencil printi...

Posted On: June 13th, 2017 | By: Phil Zarrow & Dr. Ron Lasky

Calculating Oddly-Shaped Aperture Area Ratios

How to calculate the area ratio of unusually shaped apertures, such as the elongated D-shape. ...

Posted On: February 12th, 2016 | By: Christopher Nash

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design

We can minimize large ground plane solder voiding in electronics assembly by modifying stencil design. ...

Posted On: January 5th, 2015 | By: Ed Briggs

The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...