ELV Legislation Update (I)
Under-the-Hood: The “Death Valley” of Power Electronics New insights in April into changes in the European ELV (End-of-life vehi...
Under-the-Hood: The “Death Valley” of Power Electronics New insights in April into changes in the European ELV (End-of-life vehi...
Folks I was chatting recently with Indium Corporation’s Mike Fenner about Sn/Cu alloys for solder paste. Mike has many years of experience ...
When you think of solders, you generally think of tin, lead, copper, silver. But have you ever considered bismuth? Bismuth as a pure metal...
Folks, A few years ago, Prismark estimated that the world electronics usage of lead was 18,500 tons per year. Assume most solder at the time was ...
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...
Tabbing Ribbon Solar tabbing ribbon typical consists of 10-15 micrometers of solder alloy coated on OFHC or ETP copper strip. SN60, (60% tin and 40% l...
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. Wi...
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
There has been a increase in the number of requests for reflow profiles for lead-free solders. This is a change from last year, where a majority of th...
Folks, Intel announced that they now produce lead-free flip chip solder joints in their 45 nm technology. You will recall that flip chip solder joints...
Folks, Some have said that I am a fan of lead-free assembly. It’s not true. In a world drowning in electronic waste, I am a fan of re-cycling......
Folks, In a world drowning in electronic waste, where less than 10% of electronics are recycled, RoHS is more about recycling, than protecting the env...