Avoid The Void®: Indium8.9HF Halogen-free, Pb-free Solder Paste with Andreas Karch
Andreas Karch reviews how you can Avoid The Void® with Indium8.9HF Solder Paste ...
Videos
Test Methods for ECM Assessment & Process Control: Basics of ECM
Brook Sandy-Smith and Phil Zarrow introduce a four-part series on electrochemical migration (ECM) assessment and process control...
Test Methods for ECM Assessment & Process Control: Test Methodologies & Process Control
Brook Sandy-Smith and Phil Zarrow define the meaning behind each character in a flux classification ...
Test Methods for ECM Assessment & Process Control: Process Considerations for Flux Reliability
Brook Sandy-Smith and Phil Zarrow discuss leftover flux residue's contribution to electrochemical migration ...
Test Methods for ECM Assessment & Process Control: Sources of Contamination
Brook Sandy-Smith and Phil Zarrow explore several sources of contamination ...
Avoid the Void®: Voiding in High-Temperature Soldering
Gold-tin eutectic solder can be used as the second-step solder, after the initial die-attach step. ...
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Voiding is a major problem in electronics assembly, especially in high-temp applications ...
Importance of Profiling a Reflow Oven
Trying to select and develop the proper reflow profile? This video explores the differences between the three main profile types. ...
Calculating Confidence Intervals of Cpk in Stencil Printing
In stencil printing, the basic foundation is transfer efficiency. About two-thirds of all end-of-line defects can be traced back to the stencil printi...
Calculating Oddly-Shaped Aperture Area Ratios
How to calculate the area ratio of unusually shaped apertures, such as the elongated D-shape. ...