Indium Corporation was presented with the prestigious SMTA Corporate Partnership Award during SMTA International 2018. Indium Corporation was also presented with the SMTA Expo Participation Award. October 2018.
Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Min Yao earned a Best Paper Award during the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018 for their paper Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications. October 2018.
Indium Corporation was presented with the Electronics Manufacturing (EM) Asia Innovation Award for its Indium10.1HF Solder Paste during NEPCON China. The award program recognizes and celebrates excellence in the Asian electronics industry, encouraging companies to achieve the highest standards and push the industry forward. May 2018.
Greg Wade, Technical Support Engineer, Global Accounts, earned the IPC Committee Leadership Award in recognition of his excellence in leadership in the development of the industry standard IPC-7526A, Stencil and Misprinted Board Cleaning Handbook. April 2018.
Mary Ma, Research Chemist, earned the “Best Paper” award at the SMTA China East Technology Conference 2018 for her paper titled Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175°C. April 2018.
Indium Corporation was presented with the SMT China Vision Award for its Indium10.1HF Solder Paste during NEPCON China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. April 2018.
Indium Corporation was presented with the ON Semiconductor Award for its “perfect quality.” Indium Corporation, one of more than 3,000 ON Semiconductor production suppliers, was selected for its commitment to ensuring high quality and supply continuity in an evolving semiconductor market. April 2018.
Indium Corporation was presented with the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX EXPO technical conference. The NPI Awards recognize the leading new products for electronics assembly during the past year. Honorees are selected by an independent panel of practicing engineers. February 2018.
Rick Short, Corporate Associate Vice President and Senior Director of Marketing Communications, and Jim McCoy, Talent Acquisition Supervisor, earned the CNY BEST Award for Individual/Team by the CNY chapter of the Association for Talent Development (ATD). They were recognized for their passion, foresight, and continued participation in making the Oneida-Herkimer-Madison BOCES (OHM BOCES) Pathways in Technology Early College High School (P-TECH) program a success. November 2017.
Indium Corporation was presented with the CIRCUITS ASSEMBLY Service Excellence Award for Materials during the IPC APEX EXPO technical conference San Diego, California. The Service Excellence Awards recognize electronics manufacturing companies that, as judged by their own customers, demonstrate the highest performance across the areas of technology, responsiveness, dependability, quality, and value for price. February 2017.
Dr. Ning-Cheng Lee, Vice President of Technology, was honored as IEEE Fellow 2016, November 2016.
Indium Corporation was presented with the Business Leadership Award at the New York Association of Training & Employment Professional’s (NYATEP) 2016 Statewide Workforce Awards Ceremony on Oct. 26 in Albany, NY, for its outstanding workforce development advocacy demonstrated through its intern program leadership, November 2016.
Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill. This award has acknowledged outstanding innovations in the printed circuit board assembly and packaging industry. This is the fourth consecutive year that Indium has won this award, October 2016.
Indium Corporation was presented with the ON Semiconductor Award for “Perfect Quality” in 2015. This award is the recognition for Indium’s product and service, June 2016.
Indium Corporation was honored with Circuits Assembly’s Service Excellence Award for a materials company at the IPC APEX Expo. The Service Excellence Award recognizes electronics companies that, as judged by their own customers, demonstrate the highest performance across the areas of Technology, Responsiveness, Dependability, Quality, and Value for Price. March 2016.
Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany. This award has acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years. November 2015.
Dr. Ning-Cheng Lee, Vice President of Technology, was honored at SMTAI 2015 as the recipient of the Surface Mount Technology Association's (SMTA) 2015 Founder's Award, October 2015.
Indium Corporation was honored Excellence in Soldering Award from EM Media LLP at the EM Best of Industry Awards 2015 in Pragati Maidan, New Delhi, representing how Indium Corporation is meeting customers’ explicit needs through excellent technical support and expertise, September 2015.
Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its creativeness, technological advancement, and contributions to help reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment.
Indium Corporation earned Rockwell Collins’ Trusted Supplier Program - Premier Platinum Badge, recognizing Indium’s performance as a supplier in technology innovation, customer support, total cost of ownership, zero defects PPM and almost 100% delivery in time, March 2015.
Greg Evans, President and CEO, was awarded with the Businessman Award by Cheongjy City for the outstanding performance of Indium Corporation’s Korean facility and its contribution to the Cheongju City economy, March 2015.
Indium Corporation’s LV1000 flux coating for solder preforms was presented with CIRCUITS ASSEMBLY's NPI Award at the IPC APEX Expo on Feb. 24 in San Diego, California. It recognizes the electronics assembly industry's leading new products, February 2015.
Ed Briggs’s Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes has made the top 10 list of SMT Tech Tuesday articles for 2014 by SMTOnline, one of the PCBA industry's most respected publications. This is the third consecutive year that an Indium Corporation authored paper has been named to this list, January 2015.
Indium Corporation was presented with the SMTA Corporate Award, which is presented to an SMTA member company that has shown exceptional support for the association, September 2015. Indium Corporation previously won this award in 2010.
Indium Corporation’s Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, was presented with the 2014 William D. Ashman Award at the 47th International Symposium on Microelectronics on Oct. 14, 2014, in San Diego, Calif.
Global SMT & Packaging magazine’s Global Technology Award in the Solder Paste category for BiAgX® Solder Paste Technology. The award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. This is the second consecutive year that Indium Corporation has won the Solder Paste award, September 2015.
Wisdom Qu, Assistant Technical Manager in China, earned a Best Paper award at the SMTA China South conference for her for her paper, titled Epoxy Flux – A Low-Cost, High-Reliability Approach to PoP Assembly, September 2014.
Greg Evans, President and CEO, is awarded the Alumni of Merit Award from Mohawk Valley Community College, May 2013.
"Best in Session" technical paper award, IMAPS 2012, "High Reliability, High Melting Lead-Free Mixed BiAgX Solder Paste System", Dr. Ning-Cheng Lee.
"Best Soldering Paper" at the 5th International Brazing and Soldering Conference (IBSC), hosted by ASM International and the American Welding Society on April 22-25, 2012, in Las Vegas, Nevada.
"Best Presentation of Technology Conference One", Dr. Ning-Cheng Lee, NEPCON China (Shanghai) 2011, Surface Mount Technology Association (SMTA) China East.
"Components, Packaging, and Manufacturing Technology Society (CPMT) Electronics Manufacturing Technology Award", IEEE, Dr. Ning-Cheng Lee, for his contributions to electronics manufacturing technology.
LED Journal's "Innova Award", for Heat-Spring® thermal interface material. This award recognizes, "leading companies within the LED market which have shown, through their products and services, the most innovative and advanced technology breakthroughs in LEDs.", May 2010.
"Engineering Company of the Year", Mohawk Valley Engineers' Executive Council (MVEEC), 2010.
Earned Samsung Corning Precision Glass’s Superior Vendor Award, 2010.
Earned Shinwa’s 2009 Best Supplier Award, 2010.
Earned Celestica’s 2009 Total Cost of Ownership Supplier Award for Product Innovation, 2010.
Earned Intel’s Quality Operating System Award for first two quarters of 2009.
Earned Intel’s 2007 Preferred Quality Supplier Award for outstanding performance in providing Thermal Interface Material products and services, 2008.
Awarded Business of the Year by the Mohawk Valley Business Journal, 2007.
Greg Evans, Indium Corporation President, is honored with the SMTA Founder’s Award, 2005.
Honored with award for outstanding performance in quality and service as a supplier to a major battery manufacturer, 2004.
Earned New York State Governor’s Award for Achievement in Exporting, 1988.
Awarded US Army/Navy "E" Award for Manufacturing Excellence, 1942.
Frost & Sullivan Award
According to Frost & Sullivan, awards are presented to companies "for exhibiting a superior knowledge of customer needs and the ability to exceed customer expectations." Indium Corporation was chosen to receive the award based on an in-depth analysis of market competitors, and interviews with companies that make up the SMT soldering materials industry.
"These awards are special because they are presented by the largest and most respected research firm in the world," said Rick Short, Director of Corporation Communications. "It is truly a tribute to the global Indium Corporation team."
Previous Frost & Sullivan Awards include:
- 2003: Product Innovation Award for the development of NC-SMQ230 Pb-Free Solder Paste
- 2000: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets
- 1998: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets
Triple Awards for NF260 No-Flow Underfill
Indium Corporation’s introduced the world’s first Pb-Free, Reworkable, Air-Reflowable, No-Flow Underfill, called NF260, in 2005. Since its introduction Indium’s NF260 No-Flow Underfill has won awards on three continents for its quality and innovation, as well as its ability to enhance customers’ finished goods reliability and cost savings.
China - EM China Innovation Award was presented at Nepcon Shanghai (Shanghai, China) in 2006
North America - SMT Vision Award was presented at IPC/APEX (Anaheim, California, USA) in 2006
Europe - Global SMT Technology Award for Innovation was awarded at Productronica (Nuremberg, Germany) in 2005
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.