Dr. RunSheng Mao is a Research Chemist at Indium Corporation. He obtained his bachelor’s and master’s degrees in chemistry from the University of Science and Technology in China. After working at the Guangzhou Institute of Chemistry, Academia Sinica, for more than five years, he went on to earn his Ph.D. in chemistry from the University of Salford (UK). RunSheng then spent several years doing postdoctoral research at the University of Salford and Washington State University before joining Indium Corporation in 2001.
At Indium Corporation, RunSheng led the development of a new generation of water-soluble solder paste products, including Indium6.2, Indium6.3, and Indium6.8 for tin-lead, and Indium3.1, Indium3.1AF, Indium3.2, and Indium3.2HF for lead-free alloys. He also developed some new solder preform flux coatings, such as the NC9-TCI series that can provide thermochromic indicator functions. RunSheng also played an important role in developing Indium7.08 and Indium7.16 BiAgX®high-temperature lead-free solder paste, which may be used as a substitute for high lead-containing solder paste. RunSheng has co-authored more than 40 papers that were published in scientific journals and has presented at a number of technical conferences worldwide.