Indium Corporation to Feature Precision AuSn Preforms at SPIE Photonics West
January 24, 2020
Indium Corporation will feature its precision AuSn preforms for die-attach applications at SPIE Photonics West, Feb. 1-6, in San Francisco, Calif., USA.
Indium Corporation’s AuLTRA™ ThInFORMS™ are a 0.00035” (0.00889mm) thin 80Au20Sn preform for die-attach applications. They reduce solder volume, solder wicking, and voiding thereby improving thermal transfer and the overall operational efficiency of the package.
For more information about Indium Corporation’s precision gold products, see our experts at the show at booth #4584 or visit www.indium.com/gold.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.