Avoid the Void®: Indium Corporation’s Indium8.9HF Solder Paste To Be Featured at SMTAI
July 26, 2016
Indium8.9HF is specifically formulated to Avoid the Void® while delivering high transfer efficiency with low variability.
This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology.
In addition to outstanding print transfer and response-to-pause, Indium8.9HF Solder Paste also provides a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.
Indium8.9HF Solder Paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void®. For more information about Indium8.9HF, visit Indium Corporation’s booth #429, email email@example.com, or visit www.indium.com/indium8.9series.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.