Indium Corporation Expert to Present at IMAPS Autumn Conference 2019
September 17, 2019
Karch will present Flux Systems in Solder Pastes: The Demands on Electrical Reliability are Increasing. He will discuss how the advancing electricification of automobiles and the increase in operating hours often associated with plug-in hybrid electrical vehicles (HEV) and zero-emission vehicles have placed higher demands on the electrical reliability of no-clean fluxes. He will also discuss how tests designed to show proof of electrochemical durability, such as surface insulation resistance (SIR), have evolved to meet the increased demands on the flux chemistry.
As a Regional Technical Manager, Karch provides support, including sharing process knowledge and making technical recommendations, for the use of Indium Corporation’s solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.