Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMS2016
April 28, 2016
Indium Corporation will feature LV1000 solder preform flux coating at the IEEE International Microwave Symposium (IMS2016) May 22-27 in San Francisco, Calif.
LV1000 is a high-reliability flux coating for solder preforms. LV1000 helps to Avoid the Void® by producing a resultant solder joint that has less than 2% voiding.
LV1000 increases productivity, throughput yields, and component performance. LV1000 is halide-free, meets the ROL0 requirement without sacrificing strength, and passes Telcordia GR-78 requirements in both active and inactive states.
LV1000 provides a durable, level, clear coating that does not clog pick and place equipment, even in automated assembly processes. It offers complete coverage, even with a weight percentage as low as 0.5 percent.
Flux coatings provide consistent, uniform amounts of flux every time, with excellent control over the flux volume/weight percentage. Indium Corporation’s flux-coated solder preforms come in a variety of packaging and can be color-coded for easy visual identification. The company’s flux coatings are applied to the outside of the preform where the flux is required, rather than in the core.
Indium Corporation will be exhibiting at booth 2521.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.