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Indium Corporation Features InFORMS® Reinforced Solder Ribbon for Automated Assembly at IMAPS 2017

August 22, 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 50th Anniversary Symposium, Oct. 10-12, in Raleigh, N.C.

Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:

  • Increases lateral strength
  • Maintains bondline co-planarity
  • Improves thermal cycling reliability

For more information about InFORMS, visit www.indium.com/inform.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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