Indium Corporation Highlights Gold-Based Solder Paste
May 23, 2019
Indium Corporation's line of gold-based solder paste is used in a variety of high-reliability applications.
Gold-based solder pastes offer numerous benefits, such as high tensile strength, high-melting point for compatibility with subsequent reflow processes, high thermal and electrical conductivity and thermal fatigue, resistance to corrosion, and excellent wetting. AuSn solder pastes also are resistant to oxidation and are RoHS compatible.
Gold-based solder pastes are an ideal solution for high-volume, high-power LED module assembly, as well as a range of specialty soldering applications. Higher yields and cost per unit make gold-based solder paste a viable option, even though the initial cost may be higher that alternative solders.
No-clean and water washable gold-based solder pastes are available in AuSn and AuGe alloys, eutectic and off-eutectic formulas, and Types 3–7 powder sizes. For more information about gold-based solder pastes, visit: https://www.indium.com/solder-paste-and-powders/gold-based-solder-paste/.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.