Indium Corporation Expert to Present at IWLPC 2017
October 10, 2017
Dr. Liu’s presentation, Challenges of Ball-Attach Process Using Flux for Fan-Out Wafer/Panel-Level Packaging, discusses the increasing popularity of fan-out wafer-level packaging (FOWLP) and panel-level packaging (PLP) in the semiconductor industry. FOWLP and PLP have potential advantages, including cost reduction, when compared to conventional flip-chip packages and alternative forms of heterogeneous device integration, such as system-in-package. However, one key challenge when using these substrates is warpage of the reconstituted carrier. Dr. Liu will explore various aspects of flux properties that should be considered when choosing a flux to improve yields in regard to these warpage issues.
Dr. Liu’s areas of expertise include the development of fluxes and solder pastes for both traditional and 3D SMT applications. In addition, she has developed advanced materials for semiconductor applications, such as BGA and flip-chip attachment, wire bonding, and, most recently, Cu-pillar. Dr. Liu has also explored solder materials for LED applications, and her current research emphasizes solder materials for high-end 3D packaging. Dr. Liu joined Indium Corporation in 2001.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.