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Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at BiTS Workshop 2017

February 15, 2017

Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring® and HSMF-OS, at Burn-in & Test Strategies Workshop on March 5-8 in Phoenix, Ariz.

Indium Corporation’s Heat-Spring® is designed for use in the burn-in process. It is patterned to optimize contact with non-planar surfaces and provides 86W/mK of thermal conductivity using a pressure range of only 35-100+ psi. Heat-Spring® is available in alloys including InAg, InSn and pure indium.

HSMF-OS is a multi-layer construction with a total thickness of 0.004” that is designed for high insertion capability. The interface, consisting of aluminum and non-silicone polymer, has a tensile strength of approximately 90MPa with a soft, compliant polymer backing, which provides a configuration with “designed-in” insertion survivability.

To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit

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