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Maria Durham

Indium Corporation Technology Expert to Present at IMAPS Conference on Device Packaging

February 10, 2015

Indium Corporation's Maria Durham, technical support engineer for semiconductor and advanced assembly materials, will present at IMAPS's International Conference and Exhibition on Device Packaging March 17-19 in Scottsdale, Ariz.

The semiconductor assembly industry continues its movement toward finer pitch, combined with reduced copper pillar height. As a result, cleaning processes are increasingly difficult. Durham's presentation, Ultra-Low Residue (ULR) Semiconductor-Grade Fluxes for Flip-Chip and MEMs Application, discusses the use of semiconductor-grade ultra-low residue no-clean fluxes to meet this industry challenge. Her presentation will also discuss the benefits of using a ULR no-clean flux.

Durham serves as technical liaison between Indium Corporation's customers and internal departments, such as sales, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor's degree in physics and applied mathematics from Clarkson University, Potsdam, N.Y.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses, and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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