Video Library

Video Library

Get a first-hand look at Indium Corporation's product, application, and technical expertise through our versatile video library.

Applications: Packaging

Voiding in Die-Attach

Adopting Semiconductor Assembly Process Techniques and Technologies

Causes and Solutions for Voiding in Die-Attach

Driving the Packaging Frontier: Part 1

Flip-Chip/BGA Balling: Halogen-Free/Halide-Free

Flux Challenges Regarding Flip-Chip/BGA Balling

Applications: Sealing

Abundant Indium

Applications: Soldering

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part III of III

Tech Seconds with Phil Zarrow: Choosing a Solder Paste

Why Solder Paste is Not a Commodity: Properties that Make a Superior Solder Paste

How to Properly Use Cp and Cpk in SMT Assembly

Reducing Voiding in Bottom Terminated Components Using Solder Fortification® Preforms

Tech Seconds with Phil Zarrow: Choosing a Solder Paste Supplier

Solder Redefined Video 4: Baseplate to Heat-Sink

Importance of Profiling a Reflow Oven

Calculating Oddly Shaped Aperture Area Ratios

RoHS Ten Years Later: The Transition to Lead-Free Electronics Assembly

Tech Seconds with Phil Zarrow: Considerations for Switching to a VOC-Free Wave Solder Flux

Tech Seconds: Voiding - Symptom or Defect?

Improve SMT Stencil Printing using StencilCoach®

How NanoFoil® is Used in Soldering Applications

SMT Line Balancing Using LineCoach® Software

Tech Seconds with Phil Zarrow: How to Eliminate Head-in-Pillow (HIP) Defects

An Introduction to Particle Size and Printing Smaller Area Ratios

In-Circuit Testing with Fast-Break Residue No-Clean Solder Paste

How Process Variables Affect Variation in QFN Voiding

SMT Processes Certification

Tech Seconds with Phil Zarrow: How to Select Wave Flux

Assessing Field Reliability and Defect Rates in Electronics Assembly

Indium Corporation: Productivity

SMT Reflow Profiling: Using ReflowCoach®

Tech Seconds with Phil Zarrow: How to Troubleshoot Head-in-Pillow (HIP) Defects

Autonomous Automobiles: The Ultimate Electrical Reliability Challenge

Indium Corporation: Profitability

SMT Wave Soldering: WaveCoach® Helps Optimize Profiling

Tech Seconds with Phil Zarrow: Kapton Tape for Reflow Profiling

Avoid the Void®

Indium Corporation: Response-To-Pause

Solder Fortification

Tech Seconds with Phil Zarrow: Paste Storage & Handling: Ambient Temperatures

Avoid the Void® Common Causes of Voiding in Electronics Assembly

Introduction to Head-in-Pillow and Non-Wet Open Defects

Solder Fortification for Electronics Assembly

Tech Seconds with Phil Zarrow: Paste Storage & Handling: Leftover Paste

Avoid the Void®: Beyond QFN Voiding

Maximizing Uptime in Electronics Assembly

Solder Paste Storage & Handling Best Practices

Tech Seconds with Phil Zarrow: X-ray Analysis Electronics Assembly

Avoid the Void®: Voiding in High-Temperature Soldering

Minimizing Head-in-Pillow Defect in SMT Assembly

Solder Redefined Video 1: Introduction

Tech Seconds: Troubleshooting Voiding

Defects Eliminated. Reliability Delivered.

Overcoming the Challenges Associated with Halogen-Free

Solder Redefined Video 2: Die-Attach

Tech Seconds: When to Use a Shoulder Profile

Design Solutions for Engineered Solders

Printing Differences Between No-Clean and Water-Soluble Solder Pastes

Solder Redefined Video 3: DBC Substrate to Baseplate

The Correct Formula for Solder Alloy Density

Effect of Reflow Environment on No-Clean Residue and Surface Insulation Resistance (SIR)

Process Capability: Cpk and Cpu in Relation to Purity of Compounds from Indium Corporation

Surface Insulation Resistance (SIR) and Flux Designation (ROL) Defined

The Difference Between Halogen and Halides

Electrical, Thermal, and Mechanical Reliability of Electronics Assembly

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part I of III

Surface-Mount: Reflow Soldering & Thermal Profiles

We Know SMT: Stencil Printing

Exploring the Wet Gold Technique to Measure Precious Metal Content

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part II of III

Tech Seconds with Phil Zarrow: Best Place to Attach Thermocouples

When to Use Nitrogen in SMT Wave Soldering

Gold-Indium (AuIn) Alloys for High-Reliability Braze Solutions

Applications: Thermal

LEDs Everywhere: How Indium Factors into LED Manufacturing