Corporate Communications

Webinar Archive Library

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs) web logo
Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs)
September 22, 2020
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Presenter: Ivan Castellanos

Los BTCs (Bottom Terminated Components) son componentes cada vez más comunes en la industria electrónica actual y con tendencia a incrementarse debido a su tamaño pequeño, excelente desempeño eléctrico y su habilidad de transferir el calor fuera del circuito integrado (IC).

PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions web logo
PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions
September 9, 2020
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Presenter: Bob Willis

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens.

Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies web logo
Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies
September 2, 2020
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Presenter: Andreas Karch

The reliability specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements of duration of use (increased cycles) as well as increased service temperatures (125-200°C). 

Innovations in Liquid Metal Thermal Interface Materials web logo
Innovations in Liquid Metal Thermal Interface Materials
August 27, 2020
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Presenter: Miloš Lazić

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. 

Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns web logo
Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns
August 6, 2020
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Presenter: Joy Valencia

Indium Corporation’s summer internship program is not your average internship. And, to truly understand the unique experience, who better to ask than the interns themselves?

 

 

5G Connectivity: Challenges and Gold Solutions web logo
5G Connectivity: Challenges and Gold Solutions
August 5, 2020
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Presenter: Jenny Gallery

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. 

Cleaning No Cleans – Doesn’t Have to be a Dirty Job web logo
Cleaning No Cleans – Doesn’t Have to be a Dirty Job
August 4, 2020
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Presenter: Brian O’Leary of Indium Corporation, Debbie Carboni of Kyzen

There are very good reasons why the industry continues to use no-clean solder paste. However, there are also equally good reasons why a no-clean solder paste may still need additional cleaning. 

What's Driving: Automotive Electronics Assembly and Packaging  web logo
What's Driving: Automotive Electronics Assembly and Packaging
July 28, 2020
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Presenter: Andy Mackie, PhD, MSc

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation.

Innovación en soldadura de baja temperatura – Durafuse™ LT y el rango de baja a media te web logo
Innovación en soldadura de baja temperatura – Durafuse™ LT y el rango de baja a media te
July 21, 2020
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Presenter: Ivan Castellanos

En soldadura de baja temperatura, no existe una aleación que cumpla con todos los requerimientos. La temperatura real o actual para condiciones de “baja temperatura” puede tener un rango muy amplio. 

 

Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms web logo
Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms
June 23, 2020
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Presenter: Karthik Vijay

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. 

Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs) web logo
Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs)
June 11, 2020
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Presenter: Dr. Ron Lasky

Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC).

Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering web logo
Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering
May 21, 2020
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Presenter: Robert McKerrow

Adoption of robotic soldering is growing within the PCB Assembly industry. This method is more efficient than hand soldering, so it aids in alleviating human mistakes. 

Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space  web logo
Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space
May 13, 2020
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Presenter: Claire Hotvedt

Low temperature soldering is not a one alloy fits all situation. The actual temperature required for “low temperature” applications can vary widely.

DPAK Voiding: A Study to Determine the Origins of DPAK Voiding web logo
DPAK Voiding: A Study to Determine the Origins of DPAK Voiding
April 28, 2020
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Presenter: Kim Flanagan

Indium Corporation’s Kim Flanagan, Technical Support Engineer, Senior Product Manager for Engineered Solder Materials, will host a webinar on liquid metal thermal interface materials.

View our list of upcoming webinars