Corporate Communications

Webinar Archive Library

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Solder Preform World – FREE Bob Willis Charity Webinar web logo
Solder Preform World – FREE Bob Willis Charity Webinar
June 24, 2020
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Presenter: Graham Wilson

The webinar, Solder Preform World, will examine the creative world of solder preforms, from the basics to their current use as incredibly engineered options with a wide range of possibilities. 

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Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms web logo
Power Electronics: Improve Bondline Control & Reliability with Reinforced Matrix Preforms
June 23, 2020
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Presenter: Karthik Vijay

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. 

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Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs) web logo
Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs)
June 11, 2020
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Presenter: Dr. Ron Lasky

Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). View Now

Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering web logo
Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering
May 21, 2020
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Presenter: Robert McKerrow

Adoption of robotic soldering is growing within the PCB Assembly industry. This method is more efficient than hand soldering, so it aids in alleviating human mistakes.  View Now

Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space  web logo
Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space
May 13, 2020
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Presenter: Claire Hotvedt

Low temperature soldering is not a one alloy fits all situation. The actual temperature required for “low temperature” applications can vary widely. View Now

DPAK Voiding: A Study to Determine the Origins of DPAK Voiding web logo
DPAK Voiding: A Study to Determine the Origins of DPAK Voiding
April 28, 2020
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Presenter: Kim Flanagan

Indium Corporation’s Kim Flanagan, Technical Support Engineer, Senior Product Manager for Engineered Solder Materials, will host a webinar on liquid metal thermal interface materials. View Now

View our list of upcoming webinars