Indium Corporation Features Gold Alloy Solder Preforms at SPIE Defense + Commercial Sensing Expo
February 27, 2018
Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Defense + Commercial Sensing Expo, April 15-19, in Orlando, Fla.
Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making it compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation's AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Semiconductor-grade AuSn preforms are designed specially to meet the challenges facing RF and power semiconductor devices as they continue to get smaller, with increasing power density and power ratings.
Indium Corporation's Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs. For more information about Indium Corporation's gold alloy solder preforms, visit us at booth 1714 or go to www.indium.com/gold.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.