Indium Corporation to Feature Innovative New Low-Temperature Alloy Technology at Productronica
November 6, 2019
Indium Corporation will feature its new high-performance, high-reliability low-temperature alloy technology at Productronica, November 12-15, Munich, Germany.
DurafuseTM LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, DurafuseTM LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. DurafuseTM LT:
- Provides a solution for heat-sensitive components and flex polymers
- Prevents thermal warpage of processor components and multilayer boards
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications
To learn more about Indium Corporation’s innovative low-temperature technology, visit the company at Productronica, Hall A4, Booth 214 or online at www.indium.com/solders/solder-alloys/.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.