Indium Corporation Announces New Jetting Solder Paste
November 10, 2022
Indium Corporation® has announced a new jetting solder paste in its line of PicoShot® products. PicoShot® WS-5M is designed for customers needing an SnPb solder paste for their Mycronic MY-series jet printers.
PicoShot® WS-5M is a water-soluble, halogen-free paste developed as a result of a close, collaborative relationship with Mycronic for their MY 600/700 jetting systems. This product has been beta-tested at customer sites, showing proven performance on customer lines.
PicoShot® WS-5M has been extensively tested to provide exceptional jetting performance. It delivers:
- Smallest dot volume among pastes in its class: 6.5nl/dot, 350µm diameter
- Precision deposit (x,y targeting)
- Long usage (syringe life) >8 hours
- Minimal statellites
PicoShot® WS-5M is a water-soluble, halogen-free solder paste approved after joint Indium/Mycronic technical development with Mycronic's MY 600/700 jetting systems. PicoShot® can be used in applications, such as jetting into cavities and uneven/warped substrates, high-mix/low-volume stencil replacement, CSP/microBGA solder attach, military and aerospace jetting applications, system-in-package (SiP), camera module assembly where an overmolding step is required, and shield-attach and secondary processing.
Utilizing a Type 5 solder powder and an SnPb alloy, this material is inherently chemically compatible with Indium Corporation's Indium6.6HF-HD Solder Paste. PicoShot® WS-5M's unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
PicoShot® WS-5M jetting solder paste is the second material to come out of Indium Corporation's new partnership with Mycronic, a global leader in dispensing and jet printing equipment.
To learn more about Indium Corporation's jetting pastes, visit https://www.indium.com/products/solders/solder-paste/#jetting-and-microdispensing.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.