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Indium Corporation Expert to Participate in Defects Panel Discussion

March 15, 2022

Indium Corporation’s Adam Murling, assistant technical manager, will participate in a Global SMT & Packaging panel discussion on head-in-pillow (HIP) on Tuesday, April 19, at 7:30 a.m. California/10:30 a.m. New York/3:30 p.m. UK/4:30 p.m. Germany.

In Head-in-Pillow – what causes it, how do you spot it and how do you avoid it?, roundtable guests will discuss HIP’s status as traditionally one of the most difficult defects to detect while sharing common symptoms, causes, and cures of this defect. The roundtable will be followed by a live Q&A. Register for the panel here

As the assistant technical manager, Murling helps define and implement the vision, strategy, and long-term goals for the Americas-based technical support engineering department. He also provides process and product recommendations to current and potential customers in the Midwest region and is responsible for coaching, supporting, and supervising project work performed by Indium Corporation’s technical support teams. Murling joined Indium Corporation in 2014 as a technical support engineer. He has authored several tech papers and blog posts, and has presented at multiple conferences. He has a bachelor’s degree in chemical engineering and a master’s degree in engineering management, both from Clarkson University in Potsdam, N.Y.

If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar or view the extensive library of past webinars at

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

About Global SMT & Packaging

Global SMT & Packaging is a global media brand that delivers print magazines, websites, newsletters, podcasts, and video programming to electronics manufacturers across the world.

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