Indium Corporation Expert to Present at ECTC
May 13, 2021
Indium Corporation will present on preparing graphite sheets to enhance their thermal conductivity during the Electronic Components and Technology Conference (ECTC), to be held virtually from June 1-July 4.
As the power density of microelectronic devices continues to increase, more heat is generated, making effective heat dissipation an important
factor in designing microelectronic devices. As such, an important factor in the performance of electronic assemblies is thermal management via a thermal interface material (TIM). In Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction, Dr. Ning-Cheng Lee, formerly of Indium Corporation, will examine the development of a novel TIM material from graphite that enhances heat conduction vertically.
Dr. Lee was with Indium Corporation from 1986 until his retirement in 2021 as vice president of technology. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for surface-mount technology (SMT) industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT, and is an IEEE fellow. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About the ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).