Indium Corporation Experts to Present at IMAPS 2022
August 30, 2022
Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
The following technical presentations will be featured:
- A Lead-Free Lower-Temperature Solder Paste for Wafer-Level Package Application by Dr. HongWen Zhang, R&D manager, alloy group
- A Drop-in High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications by Zhang
- Investigating Optimal Process Parameters for Ultra-Fine Solder Paste Printing in SiP Assembly by Evan Griffith, product specialist
Indium Corporation's Guangyu Fan, thermal interface materials (TIMs) R&D leader, will present Thermal Performance of Liquid Metal Paste Containing Low Content of Metal Particles for Thermal Interface Materials during a poster session.
Dr. Zhang is manager of the alloy group in Indium Corporation's R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint's morphology, thus improving reliability. Dr. Zhang has a bachelor's degree in metallurgical physical chemistry from Central South University of China, a master's degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a master's degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste® materials. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers' needs. Additionally, he supports customers' enquiries, internal product trainings, and works closely with Indium Corporation's R&D team on new applications. Griffith earned his Bachelor of Engineering in Materials Science, graduating with honors, and his Master of Engineering Management from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.