Indium Corporation Features InFORMS® Reinforced Solder Preforms at APEC 2017
February 7, 2017
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2017, March 26-30, in Tampa, Fla.
InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.
In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:
- 4x improved thermal cycling reliability compared to a solder preform-only approach
- 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
- Low-voiding of <1%
- Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment
For more information about InFORMS, visit www.indium.com/informs or visit Indium Corporation at booth #525.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.