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Indium Corporation Offers Proven Jetting Solder Paste

February 18, 2021

Indium Corporation’s newest jetting solder paste, PicoShot® NC-5M, has received official approval from Mycronic as a qualified jetting solder paste. PicoShot® NC-5M and its associated purging gel are designed for customers needing a halogen-free no-clean SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules.

Developed jointly with Mycronic, PicoShot® NC-5M is a no-clean, halogen-free solder paste designed to meet the specifications of Mycronic’s MY600/MY700 jetting systems. PicoShot® can be used in standalone applications such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield attach, and microBGA. It also complements the stencil printing of Indium8.9HF. Designed as a no-clean solder paste, PicoShot® can be cleaned easily with industry standard cleaning solutions.

PicoShot® NC-5M’s formulation meets or exceeds:

  • ANSI/IPC J-STD-004B ROL0 requirements
  • Halogen-free requirements per IPC and IEC61249-2-21 standards
  • IPC standards for SIR and ECM

Additionally, PicoShot® NC-5M:

  • Provides exceptional jetting performance for a halogen-free Pb-free solder paste
  • Reflows in air or nitrogen (ppm O2 level from 50-1,000)
  • Has a clear residue with minimal flow-out
  • Significantly reduces head-in-pillow (HIP)
  • Eliminates or significantly reduces graping
  • Minimizes reflow spatter

Indium Corporation also offers a PicoShot® NC-5M conditioner (purging gel) designed to allow the rapid purging, cleaning, and long-term storage of jetting, dispense, and microdispense systems without the use of liquid solvents. PicoShot® Conditioner C-1is a chemically benign, bright blue-colored, translucent, viscous gel that aids in visual endpoint detection and prevents inconsistent dispense volumes and clogging caused by solder paste dry-out.

To learn more about Indium Corporation’s new jetting paste, visit

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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