Indium Corporation to Feature High-Reliability Products for Power Electronics at APEC
February 23, 2022
Indium Corporation offers a robust portfolio of award-winning material solutions for power electronics, supported by its global manufacturing capabilities. These innovative products were developed in collaboration with key equipment partners to provide a solution for current and emerging industry challenges, including those required by automation. The products include:
- InFORMS® reinforced solder alloy fabrications improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Indium Corporation's Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow.
- Indium Corporation also offers solutions to ease other aspects of power module manufacturing. InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the need for fixturing during assembly for a lower cost of manufacturing ownership. InTACK™ is uniquely designed for clean flux-free reflow processes, maintaining high tack strength to hold materials in place without residues or the need for extra cleaning steps in the process.
For more information, visit Indium Corporation's experts at the show at booth #1234.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. The APEC program addresses a broad range of topics in the use, design, manufacture, and marketing of all kinds of power electronics equipment. The combination of high-quality professional education seminars, a full program of referred papers, and an overflowing exhibit hall consistently provides an invaluable education each year.