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Indium Corporation to Present at IMAPS Device Packaging Conference

February 15, 2022

Indium Corporation's Evan Griffith, product specialist, will share his technical knowledge and insight on the evolution of solder paste for semiconductor applications at the International Microelectronics Assembly & Packaging Society (IMAPS) 18th International Conference and Exhibition on Device Packaging at 10:30 a.m. local time, Thursday, March 10 in Fountain Hills, Arizona, U.S. 

Advanced packaging techniques continue to evolve within the semiconductor industry. Within advanced packaging, heterogeneous integration has become a solution for those wishing to integrate distinct and complex dies into smaller packages. Many application trends are emerging to meet the challenges of heterogeneous integration which are causing the assembly process to become more intricate, with these trends requiring soldering material technology, especially that of solder flux, to be up to date and cutting edge. In Solder Flux Evolution for Heterogeneous Integration, Griffithwill discuss the evolution of solder fluxes for heterogeneous integration, including novel advancements in fluxes forflip-chip assembly, BGA ball-attach assembly, and assemblies which have advanced to necessitate fluxless component attach. 

Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste® materials. He is based at Indium Corporation's global headquarters. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers' needs. Additionally, he supports customer inquiries, internal product trainings, and works closely with Indium Corporation's R&D team on new applications. Griffith earned his bachelor's of engineering degree in materials science, graduating with honors, and his master's of engineering management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.


The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history. 

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