Indium Corporation Features Heat-Spring® for LED Manufacturing at Strategies in Light
February 9, 2016
Indium Corporation's Heat-Spring® is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.
Heat-Spring® helps Avoid the Void™ in high-power LEDs due to its superior conductivity, ease of use, and improved performance over time as compared to thermal grease alternatives. In addition, Heat-Spring® will not bake out or pump out, thus eliminating the air voids left by inferior greases that can result in thermal failures.
Heat-Spring® is reclaimable and recyclable, and is packaged in custom trays or tape & reel.
Heat-Spring® metal thermal interface material is just one of a wide range of Indium Corporation products for the LED assembly industry – from PCB assembly to die-attach to technology-enabling TIMs – which combine superior performance with ease of placement. This reduces cost, increases first-pass yields, reduces field failures, and optimizes profits.
To learn more about on Heat-Spring®, visit www.indium.com/thermal-interface-materials/heat-spring or visit Indium Corporation at booth 110.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.