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Video: BiAgX® Solder Paste Technology as a Drop-In Replacement for High-Pb Solders Part 1

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BiAgX® Solder Paste Technology as a Drop-In Replacement for High-Pb Solders Part 1:

Environmental and legislative concerns are driving consumers away from products using solders that contain lead (Pb), including solders used in die-attach applications for analog semiconductor assembly. Indium Corporation’s BiAgX® solder paste technology is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solders used in many high-reliability die-attach and electronics assembly applications.