Part II: Step-by-step Guide to minimize voiding, HiP, NWO, and Graping Defects
October 17, 2023 @ 10AM New York
Presenter: Ron Lasky, Ph.D., PE, Senior Technologist
The second part of the Defeating Defects in Electronics Assembly (SMT Process) series will cover the steps to take to minimize voiding, the head-in-pillow defect, non-wet opens and graping defects. As an example, the voiding presentation will cover optimum stencil design, stencil thickness, best reflow profiles, the effect of solder powder size, and other variables. The results of these efforts can reduce voiding from over 40% to less than 10%. More
The second part of the Defeating Defects in Electronics Assembly (SMT Process) series will cover the steps to take to minimize voiding, the head-in-pillow defect, non-wet opens and graping defects. As an example, the voiding presentation will cover optimum stencil design, stencil thickness, best reflow profiles, the effect of solder powder size, and other variables. The results of these efforts can reduce voiding from over 40% to less than 10%. Less
