The formation of copper-tin intermetallics is fundamental to a functional solder joint. In creating most solder joints, two pieces of copper – which melt at 1085°C – are bonded together with solder, at less than 230°C. Most of us, with years of experience in electronic assembly, don’t usually think of this technological “miracle” of soldering. We are able to bond two pieces of copper together at a temperature low enough where the bonding can be performed in the presence of polymer material. Without this low-temperature formation of copper-tin intermetallics, the electronic industry might not exist. However, contemporary wisdom is that these intermetallics are brittle and can result in poor thermal cycle or drop shock performance.

In this webinar, Dr. Ron Lasky will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. The brittle nature of copper-tin intermetallics will also be discussed. In addition, several graphs of intermetallic growth rate will be presented. Some of the additional ancillary effects of copper-tin intermetallic growth – such as tin whiskers and their mitigation – will also be discussed.

Electronics are getting smaller, faster, smarter, and more functional. And, more difficult to solder.

While size is being decreased, more heat is being generated in these smaller spaces. To assist with heat removal, designers are utilizing more conductive materials like glass and metal in their electronics designs. This creates new opportunities for developing innovative materials for soldering highly metalized components and PCBs.

Join us for a panel discussion/webinar on effective solutions for these high thermal demand applications.

Join Indium Corporation’s technical expert Karthik Vijay, technical manager, Europe, Africa, and the Middle East, as well as representatives from Advanced Rework Technology Ltd., and Metcal as they share insights on this important topic in a panel discussion moderated by Chrys Shea, President of Shea Engineering Services.

Tin whiskers continue to be a major concern in electronics assembly. This workshop will start with an explanation of tin whiskers and their formation. Then, it will summarize their potential risks and mitigation techniques. A description of Failure Modes and Effects Analysis (FMEA) as a technique to assess tin whisker risk, for a given technology, will then be discussed.

Presenter Dr. Ron Lasky will conclude this workshop with a discussion of tin whisker reliability strategies for consumer and mission critical products. At the end of the presentation, attendees will have all of the basic relevant information to develop an effective tin whisker strategy.