Reliance on complex, costly alignment fixturing is growing as power module designers seek repeatable manufacturing and to achieve high-reliability performance. Flux-free soldering techniques are being deployed widely to meet the increasing requirements for quality, low voiding and cleanliness driven by Automotive/EV use cases. The emergence of sintering materials for SiC module applications are also a key consideration as manufacturers look at opportunities to scale processes and leverage the high-performance properties. 

An emerging material technology, InTACK™, can be applied during assembly to provide robust tacking strength and reduce the dependency on customized fixturing. The absence of residue and contamination with InTACK™ make this a viable option for flux-free soldering and sintering applications where cleanliness directly influences reliability performance. Test data is analyzed to evaluate material characteristics for dispensing, tack strength, and post-processing. In addition, case studies are reviewed to demonstrate opportunities for reduced process steps, cycle time, and overall cost of ownership in power module manufacturing.