White Heat – Red Hot: The Thermal Management Market in High-Performance Computing and Artificial Intelligence/Machine Learning

Thermal interface materials (TIMs) are typically thin films of material that transfer heat from one surface to a cooler one. The thermal engineer or thermal architect is faced with many choices when assessing which TIM will best conduct heat away from sensitive devices. Pure metal or metal-based TIMs may be overlooked, even though their inherently high bulk thermal conductivities and higher performance make them worthy of consideration.

Metal TIMs have been successfully used for decades in high-end applications such as power amplifiers for military and aerospace; in single-die lidded packages for high-end server CPUs; and in consumer PC applications where even liquid metals have been used. The enormous increases in demand for reliable high-performance computing (HPC) and artificial intelligence/machine learning (AI/ML) applications, combined with both increased heat flux (W/cm²) and increased device sensitivity to temperature have led to a major semiconductor packaging focus on low thermal resistance solutions. Metal TIMs are an increasingly prominent part of that mix.

This webinar will examine the specific ways that the HPC and AI/ML market segments are driving an enormous growth in demand for high performance, and, increasingly, for metal-based TIMs, and will also explore how continuous innovation at Indium Corporation is allowing us to meet that demand.